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Trends in Standalone DRAM - 80 nm to 32 nm, October 2008 (Applications, Product, Technology & Production)
This report discusses current trends in DRAMs including applications,
products, manufacturing and technology. DRAM technology is traced from the
current 65 nm to 80 nm devices in production to 32 nm - 50 nm DRAM technologies
in development by vendor. Applications are noted by technology and include
the high performance server and PC DRAMs, the low power mobile DRAMs for hand-helds,
and high bandwidth graphics/HDTV DRAMs. Recent announcements of application
specific commodity DRAMs are discussed by vendor including: DDRx, GDDRx and
LPDDRx mobile DRAMs. Various controllers designed to use specific DRAMs are
noted. Innovative capacitor technologies and materials and various 3-D array
transistor technologies are discussed by technology node and by vendor. Various
DRAM manufacturers providing foundry services for the leading commodity DRAM
companies are also discussed along with
fabless DRAM houses. 140+ pages.
Trends in Standalone DRAM - 80 nm to 32 nm, October 2008 (Applications, Product, Technology & Production)
Table of Contents:
1. Executive Summary
2. Overview of Companies with Commodity DRAMS
2.1 Commodity DRAM Supplier Market Trends:
2.2 Companies with Commodity DRAMs by Capacitor Technology
2.3 300 mm Wafer Capacity and Equipment Trends for DRAM Suppliers and Regions
2.4 Commodity DRAM Time-Line by Product Type
2.5 World DRAM Market Trends 2006 to 2011
2.6 Commodity DRAM Cell Size and Technology Summary
2.6.1 Commodity DRAM Cell Size by Technology
2.6.2 Commodity DRAM Characteristics Over Time
2.6.3 Comparison of 6F2 and 8F2 DRAM Cell Design
3.0 Commodity DRAMs by Application Market
3.1 DRAMs for the PC Market
3.2 DRAMs for Servers and the Server Market
3.3 Mobile DRAMs For Portable Systems
3.3.1 Overview of Mobile DRAM's for Portable Systems
3.3.2 Ultra Micro DIMM Modules for Ultra Micro PC's (UMPC)
3.3.3 Mobile Systems Using DRAMs
3.3.3.1 DRAM Buffers in SSD
3.3.3.2 Personal Navigation Systems
3.3.3.3 Digital Camera
3.3.3.4 Display System Devices
3.3.4 Low Power DDR2 (LPDDR2) SDRAM
3.3 Graphics and HDTV DRAMs
3.3.1 Overview of Graphics DRAMs
3.3.2 Overview of Graphics Controllers
3.3.3 Graphics DRAM Suppliers
3.3.4 Graphics DRAM and Controller Markets
3.3.5 Characteristics of Single Ended Graphics Interfaces
3.3.6 Differential Graphics Interface
4.0 Elpida Commodity DRAMs
4.1 Elpida's Target Applications
4.1.1 Elpida Computer DRAMs
4.1.2 Elpida Mobile DRAMs
4.1.3 Elpida Graphics DRAMS
4.1.4 Elpida HDTV DRAMs
4.2 Elpida Manufacturing and Fab Announcements
4.2.1 Elpida and Powerchip Manufacturing
4.2.2 Elpida and SVG Manufacturing
4.3 Elpida DRAM Product and Production:
4.3.1 Elpida DRAM Production Technology Roadmap
4.3.2 Elpida 50 nm DRAM Production Process.
4.3.3 Elpida 65 nm DRAM Production Process
4.3.4 Elpida 70 nm DRAM Product and Production
4.3.5 Elpida 80 nm Product and Production
4.3.6 Elpida 90 nm and 100 nm Product and Production
4.4 Elpida DRAM Technology Development
4.4.1 Elpida 40-50 nm DRAM Technology
4.4.2 Elpida 65 nm DRAM Technology
4.4.3 Elpida 80nm DRAM Technology
4.4.4 Elpida 90 nm DRAM Technology
4.5 Elpida Advanced DRAM Technology Development
4.5.1 Hitachi 4F2 Vertical Transistor and Capacitor Cell
4.5.2 Elpida Copper / Low-K Dielectric Technology for DRAM
4.5.3 Variable Retention Time Problem
4.5.4 Elpida Far Future High Density Organic RAM Technology
4.6 Elpida Back-End Technology Development
5.0 Hynix
5.1 Hynix Target Markets and Applications
5.1.1.Overview of Markets and Applications
5.1.2 Hynix Computer DRAM
5.1.3 Hynix Mobile DRAMs:
5.1.4 Hynix Graphics DRAMs:
5.1.4.1 GDDR5 SDRAM
5.1.4.2 GDDR4 SDRAM
5.1.4.3 Hynix GDDR3 SDRAM
5.2 Hynix Manufacturing and Fab Announcements
5.3 Hynix DRAM Product and Production
5.3.1 Hynix 50 nm DRAM Product and Production
5.3.2 Hynix 66 nm DRAM Product and Production
5.3.3 Hynix 80 nm DRAM Product and Production
5.3.4 Hynix 90nm DRAM Product and Production
5.4. Hynix DRAM Technology Development
5.4.1 Hynix 32 nm Technology Development
5.4.2 Hynix 45 nm DRAM Technology
5.4.3 Hynix 65 nm DRAM Technology
5.4.4 Hynix 90nm/100 nm DRAM Technology
5.5 Hynix New DRAM Technology
5.5.1 Floating Body DRAM
5.5.2 Phase-Change RAM (PRAM)
6.0 Micron Technology
6.1 Micron Target DRAM Applications
6.1.1 Overview of Micron DRAM Applications
6.1.2 Computer DRAMs
6.1.3 Low Power DRAM Applications
6.1.3.1 Low Power DRAMs for Mobile Applications
6.1.3.2 Low Power DRAMs for Server Applications
6.1.4 Graphics DRAMs
6.1.4.1 GDDR3 and GDDR4 SDRAMs
6.2 Micron Fab and Manufacturing
6.3 Micron Product and Production
6.3.1 Micron 68 nm DRAM Product and Production
6.3.2 Micron 78 nm DRAM Product and Production
6.3.3 Micron 95 nm DRAM Product and Production
6.3.4 Micron 110 nm DRAM Product and Production
6.4 Micron DRAM Technology
6.4.1 Micron DRAM Technology Overview
6.4.2 50 nm DRAM Technology
6.4.3 78 nm (6F2 Cell) DRAM Technology
6.5 Micron Assembly and Test Facilities
7.0 Nanya Commodity DRAM
7.1 Overview of Nanya
7.2 Nanya Target Applications
7.2.1 Graphics DRAMs
7.3 Nanya Manufacturing and Fabs
7.4 Nanya DRAM Product and Production
7.4.1 Nanya 75 nm DRAM Product and Production
7.5 Nanya Technology Development
7.5.1 Nanya 50 nm DRAM Process
7.5.2 Nanya 60 nm DRAM Process
7.5.3 Nanya 70 nm DRAM Process
8.0 Powerchip
8.1 PowerChip Target DRAM Applications
8.2 Powerchip DRAM Fabs and Manufacturing
8.2.1 Powerchip Owned Manufacturing
8.2.2 Powerchip Joint Venture DRAM Manufacturing
8.3 Powerchip DRAM Technology
9.0 ProMOS
9.1 ProMOS Target DRAM Applications
9.2 ProMOS Alliances
9.3 ProMOS Fabs and Manufacturing
9.4 ProMOS Technology Background
9.5 ProMOS Trench DRAM Technology
10.0 Qimonda
10.1 Qimonda Target DRAM Applications
10.1.1 High End PC Graphics and Workstation DRAMs
10.1.2 Server DRAMs
10.1.3 Mobile DRAM
10.1.4 Graphics DRAMs
10.2 Qimonda Fabs and Manufacturing
10.3 Qimonda DRAM Product and Production
10.3.1 Qimonda 58nm/75nm Product and Manufacturing
10.3.2 Qimonda 75 nm Product and Manufacturing
10.3.3 Qimonda 80/90 nm Product and Manufacturing
10.4 Qimonda DRAM Technology
10.4.1 Qimonda DRAM Technology Roadmap
10.4.2 32nm/40nm DRAM Technologies
10.4.2.1 32 nm Lithography
10.4.2.2 40nm/32 nm Carbon Based Electrodes for Trench DRAM
Capacitors
10.4.2.3 Controlling Crystalline Phases of HfO2 in Capacitors
for 40nm/32nm
10.4.3 Qimonda 40 nm DRAM
10.4.3.1 Qimonda and Elpida 40 nm 4F2 Cell DRAM
10.4.4 Qimonda Fully Integrated 40 nm/48 nm DRAM
10.4.5 Qimonda 40 nm Deep Trench with EUD 3-D Array Transistor
10.4.6 Qimonda 70 nm DRAM
10.5 Qimonda Development Projects and Ventures
11 Samsung
11.1 Samsung DRAM Target Applications
11.1.1 Samsung High End PC DRAM Products
11.1.1.1 Samsung DDR3 SDRAM
11.1.1.2 Samsung DDR2 SDRAMs
11.1.2 Low Power Mobile DRAM Products
11.1.3 Graphics DRAM Products
11.1.3.1 GDDR5 SDRAM:
11.1.3.2 GDDR4 SDRAM:
11.2 Samsung Fab and Manufacturing
11.3 Samsung DRAM Product and Production
11.3.1 Samsung 50 nm Product and Production
11.3.2 60 nm Samsung DRAM Product and Production
11.3.3 68 nm Samsung DRAM Product and Production
11.3.4 80 nm Samsung Product and Production
11.3.5 Samsung 90 nm Product and Production
11.4 Samsung DRAM Technology Development
11.4.1 Samsung DRAM Development Trends
11.4.2 Samsung 40 nm DRAM Technology
11.4.2.1 Samsung SCAT Array Transistor Technology Using the
SOONO Concept
11.4.2.2 Partially Insulated RCAT Transistor to Suppress Body
Effect
11.4.2.3 Samsung 40nm FinFET Cell Transistor DRAM Technology
11.4.3 Samsung 45 nm DRAM Technology
11.4.4 Samsung 50 nm DRAM Array Transistor Technology
11.4.5 Samsung 56 nm DRAM Technology
11.4.6 Samsung 60 nm MIM Capacitor DRAM
11.4.7 Samsung DRAM Development for 68 nm Node
11.4.8 Samsung DRAM Development for 70 nm Node
11.5 Samsung High Density Packaging Technology
12 Other DRAM Suppliers
12.1 Etron
12.1.1 Etron Overview
12.1.2 Etron Low Power SDRAMs
12.1.3 Etron DDR SDRAMs
12.1.4 Etron Pseudo SRAM
12.2 Fujitsu FCRAM
12.3 SMIC
12.3.1 SMIC DRAM Wafer Fab and Production Status
12.4 Tech Singapore
12.5 Winbond
12.5.1 Winbond Products
12.5.2 Winbond Cooperation with Qimonda for 75nm and 58 nm DRAM
12.5.3 Winbond Foundry Contract With VIS in Former Winbond Fab
12.5.4 Winbond Agreement To Run Qimonda 80nm DRAM in Their 300mm fab
13. Research Cooperations in DRAMs
13.1 IMEC Research Consortium
14.0 Alternative Standalone DRAM Technologies
14.1 Spansion MirrorBit DRAM Technology
14.2 Hynix Floating Body DRAM
14.3 Sony Bulk Thyristor RAM
15.1 DRAM Research in Organizations and Universities
16.0 Interface Chips
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