Non-Volatile Embedded Memories 2008 - Applications, Technology, Products, Vendors

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Non-Volatile Embedded Memories: Applications, Technology, Products and Vendors, July 2008
(Embedded Flash, eFloating Gate Flash, eSONOS, eNanocrystal, eMRAM, eFeRAM, ePC-RAM, eCB-RAM, eMetal Oxide Memory, eMEM, Other)

This report discusses embedded non-volatile memory technology along with applications for processors, controllers and other SoC using this memory. Traditional floating gate flash continues to be used and some new innovations are discussed. Also in production are new embedded non-volatile technologies such as SONOS, MONOS, MRAM, and FeRAM. PC-RAM, PMC-RAM, Metal Oxide Memory, and Nanocrystal memory are in development for embedded memory. Recent developments in these new technologies are discussed. Non-volatile memory product announcements and technologies are reviewed by vendor, foundry, and by companies offering embedded non-volatile IP. 100+ pages.

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Table of Contents

Introduction

1.0 Overview and Executive Summary

2.0  Embedded Non-Volatile Memory Market 
2.1 Overview
2.2 Microcontroller Market

3.0  Flash MCU and SoC Characteristics and Memory Density and Application

4.0 Current Applications for Embedded Flash
4.1 Automotive Applications and Market
  4.1.2 Automotive Market
  4.1.3 Overview of Requirements for Automotive Applications
  4.1.4 Examples of Flash MCU for Automotive Applications
  4.1.5 Automotive Small Motor Control
  4.1.6 Air Bag Control
  4.1.7 PowerTrain: 
  4.1.8 CAN and LIN Devices:
  4.1.9 Power Steering Control
  4.1.10  Small In-Cabin Automotive MCU 
  4.1.11 Automotive Communications Systems
4.2  Household Appliances
  4.2.1 Overview of the Household Appliance Market
  4.2.2  Large Household Appliances
  4.2.3 Small Household Appliances
4.3 Motor Control
4.4 Industrial Systems
  4.4.1 Networked Industrial Systems
  4.4.2 Building and Lighting Control Systems
  4.4.3 Tethered Industrial Applications
4.5  Networked Computer Systems
  4.5.1 Networked PC Office Systems
  4.5.2 ZigBee Protocol Chips.
4.6 Consumer Television Systems
  4.6.1 Digital TV High Definition Interface Display Data
  4.6.2 Television Remote
4.7 Consumer Handheld Systems
  4.7.1 Sports Watches and Healthcare Monitors
4.8 LCD Controllers With Embedded Flash for Portable Battery Operated Devices 
4.9  USB Controller Chips
4.10  Smart Card Controllers
  4.10.1 Smart Card Controllers with Low Density Embedded Memory 
  4.10.2 Smart Cards (SIMS) in Advanced Applications 
4.11 Encryption and Security Processors 
4.12 RFID Chips

5.0 Embedded Floating Gate Flash Memory Technology, Test and Reliability
5.1 Reliability of Embedded Floating Gate Flash Memory
  5.1.1  SILC Due to H Atom Density for Split Gate Flash EEPROMs (NEC)
  5.1.2   Effect of Peripheral Circuits of Vth Distributions in an EEPROM
5.2  Flash EEPROM Technology
  5.2.1 Dual Channel EEPROM
5.3   90 nm Embedded Flash in Cu and Low-K Process

6.0 Embedded Trapping Site Storage  Technology, Test and Reliability
6.1 NXP SONOS low Power Embedded Flash Using High -k and Metal Gate  
6.2 Nanocrystal Storage for Embedded Flash Technology

7.0  Embedded Phase Change and Resistance RAM Technology, Test and Reliability 
7.1 Overview of  Phase-Change RAM (PC-RAM) Technology
7.2   Embedded Phase Change Memory Technology
7.3 Thompson Effect in Phase Change Memory
7.4 Embedded PC-RAM with Thin Bridge Technology

8.0   Programmable Metallization Cell RAM or Conductive Bridging Memory
8.1 Cu Ion Conductive Bridge Electrolyte RRAM
8.2 Conductive Bridge Memory in 90 nm Technology
8.3  ReRAM Made with NiO Doped with Ti:NiO

9.0 Embedded MRAM Technology, Test and Reliability
9.1  Embedded Toggle-Mode MRAM Technology
  9.1.1 Embedded MRAM Technology 
  9.1.2  MRAM Cells for High Speed Circuit Macros
9.2 Embedded Spin Torque Transfer MRAM

10.0  Embedded FeRAM
10.1 Embedded FeRAM Technology for Roughed Environments
10.2 Reliability of 2T-2C FeRAM

11.0 Novel Non-Volatile Embedded Memories in Research and Development
11.1 Electro-Mechanical Hysteretic Non-Volatile Memory
11.2  TFT MONOS on Glass Substrate (ITRI and STAR)

12.0 Companies Supplying or Developing Products with Embedded Non-Volatile Memory
12.1 Atmel 
  12.1.1  Atmel Embedded Floating Gate Flash Product
  12.1.2 Atmel Embedded Floating Gate Flash Technology
  12.1.3  Atmel Silicon NanoCrystal Embedded Memory Development
12.2 Cypress Semiconductor
  12.2.1 Cypress Embedded Flash Product Announcements
  12.2.2 Cypress SONOS Embedded Flash Technology
12.3 EM Microelectronics
  12.3.1 EM Microelectronics Embedded Flash Memory Technology
  12.3.2  EM Microelectronics Embedded Flash Memory Products
12.4 Freescale
  12.4.1 Freescale Embedded Floating Gate Flash Technology
  12.4.2  Freescale Embedded Floating Gate Flash MCU Product
  12.4.3 Freescale Silicon Nanocrystal Embedded NV Memory 
  12.4.4  Freescale MRAM Embedded NV Memory (EverSpin)
12.5  Fujitsu
  12.5.1 Fujitsu Floating Gate Flash Technology Development
    12.5.1.1  90 nm Embedded Flash in Cu and Low-K Process
  12.5.2 Fujitsu Embedded Floating Gate Flash Product Announcements
  12.5.3  Fujitsu Embedded FRAM
  12.5.4 Fujitsu  ReRAM Made with NiO Doped with Ti:NiO
12.6  Infineon /Qimonda
  12.6.1 Infineon Embedded Floating Gate Flash MCU Introductions
  12.6.2 Qimonda, IBM, Macronix Embedded PC-RAM
  12.6.3  Conductive Bridge for Embedded Non-Volatile Memory  (Altis/Infineon/Qimonda)
12.7 Macronix Embedded Non-Volatile Memory
  12.7.1 Macronix Bandgap Engineered SONOS for Embedded Flash
  12.7.2 Macronix, Qimonda, IBM Embedded PC-RAM
  12.7.3  Bandgap Engineered TFT NAND SONOS Flash (Macronix)
12.8  Matsushita
  12.8.1  Matsushita Embedded Flash Memory Product and Technology
  12.8.2 Matsushita Embedded FeRAM Technology Development
  12.8.3 Matsushita NROM Technology
12.9 MicroChip
  12.9.1 Microchip Embedded Non-Volatile Memory Development
  12.9.2 Microchip Embedded Flash Technology and Product
12.10 NEC Electronics
  12.10.1 NEC Embedded Flash Technology
  12.10.2 NEC Flash Microcontroller announcements
  12.10.3  MRAM Cells for High Speed Circuit Macros (NEC)
    12.10.3.1   2T1MJT Cell for Write Current Control
    12.10.3.2    5T2MTJ Cell for GHz Access Time  
    12.10.4 NEC Metal Oxide Switch  
12.11 Numonyx PCM Technology (Intel, STM, and Francisco Partners)
12.13 Oki
  12.13.1 Oki Embedded Flash Technology
  12.13.2 Oki Embedded Flash Product 
12.14 NXP (Philips)
  12.14.1 NXP/Philips Embedded Floating Gate Flash Technology
  12.14.2 NXP/Philips Floating Gate Embedded Flash Product
  12.14.3  NXP Embedded Phase Change Memory
  12.14.4 NXP Embedded Flash SONOS Technology
12.15   Ramtron FeRAM  Product and  Technology
  12.15.1 Ramtron FeRAM Technology
  12.15.2 Ramtron FeRAM Product
12.16  Renesas/Hitachi
  12.16.1 Renesas Embedded MONOS Technology
  12.16.2 Renesas MONOS Flash MCU Product
  12.16.3 Renesas Dual Channel EEPROM 
  12.16.4 Renesas Embedded Silicon Nanocrystal NV Memory
  12.16.5 Renesas/Grandis/Hitachi  Embedded MRAM Memory
  12.16.6  Renesas/Hitachi Embedded Phase Change Memory
  12.16.7 Renesas Embedded Memory RFID Chip Programmed Using eBeam Writing
12.17 Samsung Semiconductor
  12.17.1 Samsung Floating Gate Embedded Flash Technology
  12.17.2  Samsung FeRAM  Embedded Flash Memory Technology
  12.17.3  Polymer Resistive Memory for Simple Embedded Applications
12.18 Seiko-Epson
  12.18.1 Seiko Epson Flash MCU Announcements
  12.18.2 Seiko-Epson Embedded NV Memory Technology Development
  12.18.2 Seiko Epson FeRAM Technology Development
  12.18.3 Seiko Epson Organic FeRAM Development
12.19  Sony 
  12.19.1 Sony Spin Torque MRAM
  12.19.2 Cu Ion Conductive Bridge Electrolyte RRAM (Sony)
12.20 STMicroelectronics
  12.20.1 STM Embedded Floating Gate Flash Memory Technology
  12.20.2 STM Floating Gate Flash MCU Product
12.21 Texas Instruments
  12.21.1 Texas Instruments Embedded Flash Technology
  12.21.2 TI Embedded Flash Product 
  12.21.3 TI Embedded FeRAM Technology Development
12.22 Toshiba America
  12.22.1 Toshiba Floating Gate NV Memory Technology 
  12.22.2 Toshiba Floating Gate Flash Product 
  12.22.3 Toshiba Nano-Flash Technology 
12.23 Zilog Floating Gate Flash MCU's

13.0 Embedded Flash Memory Foundries
13.1 Austria Microsystems Foundry (Austria)
13.2 Chartered Semiconductor (Singapore)
13.3 Grace Semiconductor Manufacturing Corporation (GSMC)(China)
13.4 Hua Hong NEC (China)
13.5  ProMOS (Taiwan)
13.6  SMIC (China)
13.7 Tower Semiconductor (Israel) 
13.8  TSMC (Taiwan)
13.9 UMC
13.10 X-Fab

14.0. Companies Supplying/Developing Embedded Non-Volatile Memory IP and Services
14.1 Axon Technology
14.2  Celis Semiconductor 
14.3 Cypress
14.4  eMemory
14.5 Impinj 
14.6 Kilopass
14.7 Cavendish-Kinetics
14.8 MoSys
14.9 Saifun Semiconductor
14.10 Sidense Corporation
14.11 Simtek
14.12  SST SuperFlash
14.13 Virage Logic

Bibliography

| Description | Contents | To Purchase |

Non-Volatile Embedded Memories: Applications, Technology, Products and Vendors, July 2008 (Embedded Flash, eFloating Gate Flash, eSONOS, eNanocrystal, eMRAM, eFeRAM, ePC-RAM, eCB-RAM, eMetal Oxide Memory, eMEM, Other)

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